Advanced Certification Course in Sensor Technologies and Chip Design - IISC
Duration
5 months,50 hours of learning
Duration
5 months,50 hours of learning
Duration
5 months,50 hours of learning
Duration
5 months,50 hours of learning
Duration
5 months,50 hours of learning
Programme Overview
Sensor technologies and digital chip design are driving innovation across industries, enabling smarter, more efficient systems. From MEMS fabrication to AI-integrated sensors, advancements in this domain open doors to automation and intelligent decision-making. This exclusive advanced certification programme equips professionals with cutting-edge expertise in sensor technologies and chip design. The curriculum combines foundational principles with advanced applications, including MEMS fabrication, VLSI design, and AI-driven solutions. Participants gain hands-on experience with tools like COMSOL for FEM simulations and delve into additive manufacturing for custom electronic casing. The programme emphasizes the integration of AI, image processing, and sensors, enabling participants to create solutions for automated decision-making. Through a blend of theory, lab sessions, and case studies, this programme prepares participants to lead innovations across domains like healthcare, automotive systems, and consumer electronics, positioning them as leaders in the future of engineering.
Eligibility Criteria
- Education Qualification: Should have completed B.Tech./B.E/M.Sc./M.E./M.Tech. in Electronics, Electrical, Mechanical, Instrumentation, Physics, Materials Engineering/Science, Chemical Engineering or similar.
- Work Experience: 6 months (preferred, but not mandatory).
Selection Process
- Education Qualification: Should have completed B.Tech./B.E/M.Sc./M.E./M.Tech. in Electronics, Electrical, Mechanical, Instrumentation, Physics, Materials Engineering/Science, Chemical Engineering or similar.
- Work Experience: 6 months (preferred, but not mandatory).
Who can attend?
- Education Qualification: Should have completed B.Tech./B.E/M.Sc./M.E./M.Tech. in Electronics, Electrical, Mechanical, Instrumentation, Physics, Materials Engineering/Science, Chemical Engineering or similar.
- Work Experience: 6 months (preferred, but not mandatory).
Syllabus Breakdown
Module 1 - Introduction to Sensors and MEMS Sensor Fundamentals
- Overview of Sensors and Transducers
- Sensors and Transducer Characteristics: accuracy, precision, sensitivity, specificity, resolution, and selection criteria
- Overview of MEMS, Integration of mechanical elements, sensors, actuators, and electronics
- Importance and role of sensors and transducers in engineering fields (e.g., Industry and Biomedical applications)
- Overview of various sensor types: Temperature sensor, Motion sensor, Hall effect sensor, pMUTs and cMUTs, UV sensor, IR sensor, Pressure sensor
- Sensor Interfacing: Customized PCB Design
Module 2 - MEMS Sensor Fabrication and Characterization Techniques
- Thermal Oxidation
- Diffusion and Ion Implantation
- Deposition Techniques: Physical Vapour Deposition Techniques (PVD) (E-Beam evaporation, Thermal evaporation, and Sputtering), Chemical Vapour Deposition (CVD).
- Lithography and Patterning Techniques for Sensor Fabrication
- Introduction to Bulk Micromachining & Surface Micromachining
- Etching Techniques: Wet etching and Dry etching
- Characterization Techniques – STM, AFM, Spectroscopy, XRD
Know The Facilitators
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Course Fee
| Particulars | Amount |
| Course Fee | 5,000 |
| Application Fee | 0 |
| GST@18% | 900 |
| Total | 5,900 |